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eCover

The embedded chip is the first element to authenticate the citizen ID. IN Groupe has been a pioneer in proposing to its clients a state-of-the art electronic inlay or eCover for Passport application. Thanks to the patented inductive coupling (IDC) technology (based on SPS IN GROUPE technology), our customers can benefit from the best choice for durability, performance and flexibility in the epassport inlay.

Moreover, as our solutions are chip and OS independent, our clients have the freedom to choose their solution and have access to the latest technology.

Products and Finishing

Inlay

A certified inlay, based on a copper antenna and our eBooster®  technology module onto Teslin TM sheet. Very robust and reliable to enhance security – compatible with paper or textile cover (based on SPS IN GROUPE technology).

Teslin 2 eCover Inlay
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eCover

Complete integrated solution with our certified electronic inlay – options : hot foil (gold or silver foil cover perso), multi-thickness & dimensions and various delivery formats (based on SPS IN GROUPE technology).

eCover-2
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